Gaya APA

Chip scale package (CSP) design, material, processes, reliability, and applications. (1999). Taipei: McGraw-Hill.

Gaya Chicago

Chip scale package (CSP) design, material, processes, reliability, and applications. . Taipei: McGraw-Hill, 1999. Buku.

Gaya MLA

Chip scale package (CSP) design, material, processes, reliability, and applications. . Taipei: McGraw-Hill, 1999. Buku.

Gaya Turabian

Chip scale package (CSP) design, material, processes, reliability, and applications. Taipei: McGraw-Hill, 1999. Buku.