Gaya APA
Chip scale package (CSP) design, material, processes, reliability, and applications. (1999).
Taipei:
McGraw-Hill.
Gaya Chicago
Chip scale package (CSP) design, material, processes, reliability, and applications.
.
Taipei:
McGraw-Hill,
1999.
Buku.
Gaya MLA
Chip scale package (CSP) design, material, processes, reliability, and applications.
.
Taipei:
McGraw-Hill,
1999.
Buku.
Gaya Turabian
Chip scale package (CSP) design, material, processes, reliability, and applications.
Taipei:
McGraw-Hill,
1999.
Buku.